Method for manufacturing electronic device

ABSTRACT

An electronic device is disclosed, which includes: a panel, including: a first substrate; a second substrate, disposed opposite to the first substrate; a first protection element, disposed on a surface of the first substrate away from the second substrate; and a first polarizer, disposed on the first protection element.

CROSS REFERENCE TO RELATED APPLICATION

This application is a division of U.S. Patent application for “Methodfor manufacturing electronic device”, U.S. application Ser. No.16/142,956 filed Sep. 26, 2018, and the subject matter of which isincorporated herein by reference.

BACKGROUND 1. Field

The present disclosure relates to a method for manufacturing anelectronic device. More particularly, the present disclosure relates toa method for manufacturing an electronic device to decrease damage of asubstrate of the electronic device.

2. Description of Related Art

In the current process for manufacturing the electronic devices, twomother substrates may be assembled, and the assembled two mothersubstrates are cut into a plurality of panels before the step ofdisposing the polarizers on the panels. However, when the assembled twomother substrates are cut into a plurality of smaller sized panels,because the number of the smaller sized panels are increased, more timehas to be spent to dispose the polarizer on the panels. Therefore, thepresent disclosure provides a method for manufacturing an electronicdevice, wherein the method can reduce the above problems, or canincrease the manufacturing yield of the electronic devices.

SUMMARY

The present relates to a method for manufacturing an electronic device,comprising the following steps: assembling a first mother substrate anda second mother substrate; disposing a first protection element on asurface of the first mother substrate away from the second mothersubstrate; disposing a first mother polarizer on the first protectionelement; and processing an assembly of the first substrate, the secondmother substrate, the first protection element, and the first motherpolarizer into a plurality of panels.

The present also relates to an electronic device, wherein the electronicdevice comprises a panel, and the panel comprises: a first substrate, asecond substrate, a first protection element and a first polarizer. Thesecond substrate is disposed opposite to the first substrate, the firstprotection element is disposed on a surface of the first substrate awayfrom the second substrate, and the first polarizer is disposed on thefirst protection element.

Other novel features of the disclosure will become more apparent fromthe following detailed description when taken in conjunction with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a flow chart showing a method for manufacturing an electronicdevice of the present disclosure.

FIG. 2A to FIG. 2G are cross-sectional views showing a process formanufacturing an electronic device according to Embodiment 1 of thepresent disclosure.

FIG. 3A to 3D are cross-sectional views showing a process formanufacturing an electronic device according to Embodiment 2 of thepresent disclosure.

DETAILED DESCRIPTION OF EMBODIMENT

The following embodiments when read with the accompanying drawings aremade to clearly exhibit the above-mentioned and other technicalcontents, features and/or effects of the present disclosure. By theexposition by means of the specific embodiments, people would furtherunderstand the technical means and effects the present disclosure adoptsto achieve the above-indicated objectives. Moreover, as the contentsdisclosed herein should be readily understood and can be implemented bya person skilled in the art, all equivalent changes or modificationswhich do not depart from the concept of the present disclosure should beencompassed by the appended claims.

Furthermore, the ordinals recited in the specification and the claimssuch as “first”, “second” and so on are intended only to describe theelements claimed and imply or represent neither that the claimedelements have any proceeding ordinals, nor that sequence between oneclaimed element and another claimed element or between steps of amanufacturing method. The use of these ordinals is merely todifferentiate one claimed element having a certain designation fromanother claimed element having the same designation.

Furthermore, the terms recited in the specification and the claims suchas “above”, “over”, or “on” are intended not only directly contact withthe other element, but also intended indirectly contact with the otherelement. Similarly, the terms recited in the specification and theclaims such as “below”, or “under” are intended not only directlycontact with the other element but also intended indirectly contact withthe other element.

Here, the terms “about” or “approximately” mean within 20%, 10% or 5% ofa given value or range. The quantity given here is an approximatequantity, meaning that the meaning of “about” and “approximately” may beimplied without specific explanation.

It is to be understood that the elements specifically described orillustrated may be in various forms well known to those skilled in theart. In addition, when a structure is “on” another structure orsubstrate, it may mean “directly” on another structure or substrate, ora structure on another structure or substrate, or between otherstructures or substrates.

In addition, the features in different embodiments of the presentdisclosure can be mixed to form another embodiment.

FIG. 1 is a flow chart showing a method for manufacturing an electronicdevice of the present disclosure. The method at least comprises thefollowing steps: (S1) assembling a first mother substrate and a secondmother substrate; (S2) disposing a first protection element on a surfaceof the first mother substrate away from the second mother substrate;(S3) disposing a first mother polarizer on the first protection element;(S4) removing a part of the first mother polarizer to form a firstopening corresponding to the first protection element; (S5) cutting thefirst mother substrate; and (S6) processing an assembly of the firstmother substrate, the second mother substrate, the first protectionelement, and the first mother polarizer into a plurality of panels.

Hereinafter, the method for manufacturing an electronic device of thepresent disclosure shown in FIG. 1 is illustrated in detail in thefollowing embodiments.

EMBODIMENT 1

FIG. 2A to FIG. 2G are cross-sectional views showing a process formanufacturing an electronic device of the present embodiment.

As shown in FIG. 1 and FIG. 2A, in the step (S1), a first mothersubstrate 11 and a second mother substrate 21 are provided andassembled. It should be noted that, the assembled first mother substrate11 and second mother substrate 21 can subsequently be cut formanufacturing a plurality of panels. The first mother substrate 11 orthe second substrate 21 can correspond to a plurality of firstsubstrates 11′ (as shown in FIG. 2G) or a plurality of second substrates21′ (as shown in FIG. 2G) of panels. An electronic device can includesone panel. The material of the first mother substrate 11 or the secondmother substrate 21 can include glass, quartz, organic polymer or metal,etc. Organic polymer may include polycarbonate (PC), polyimide (PI),polypropylene (PP), polyethylene terephthalate (PET) or other plastic orpolymer material. But, the present disclosure is not limited thereto.The electronic device can include a liquid crystal (LC), an organiclight-emitting diode (OLED), a quantum dot (QD), a quantum dotlight-emitting diode (QLED), a fluorescent material, a phosphormaterial, a light-emitting diode (LED), a micro LED or a mini LED, butthe present disclosure is not limited thereto. The electronic device canbe a display device, a sensing device, an antenna device, or a lightingdevice, but the present disclosure is not limited thereto.

In one embodiment, the second mother substrate 21 can be an arraysubstrate, and the first mother substrate 11 can be a color filtersubstrate. The array substrate can include transistors, drive circuit,wires, and/or electrodes, but the present disclosure is not limitedthereto. The color filter substrate can include a color filter structureand a black matrix structure, but the present disclosure is not limitedthereto. Alternatively, the color filter structure may be disposed onthe second mother substrate 21 (such as array substrate), and the secondmother substrate 21 is a color filter on array (COA) substrate.Alternatively, the black matrix structure may be disposed on the secondmother substrate 21 (array substrate), and the second mother substrate21 is a black matrix on array (BOA) substrate. In some embodiments, aseal, a spacer, or other components can be disposed between the firstmother substrate 11 and the second mother substrate 21. A mediumstructure (not shown) can be disposed between the first mother substrate11 and the second mother substrate 21, but the present disclosure is notlimited thereto. In some embodiments, the electronic device can be aself-luminous electronic device, and the medium structure may includeOLED, LED, mini-LED, micro-LEDs, or QLED or other suitable materials,but the present disclosure is not limited thereto. In some embodiments,one of the second mother substrate 21 and the first mother substrate 11can be an array substrate, and the other one of the first mothersubstrate 11 and the second mother substrate 21 can be a coversubstrate, but the present disclosure is not limited thereto.

In another embodiment, the electronic device may be a sensing device,and the sensing device includes sensing units disposed on the firstmother substrate 11, on the second mother substrate 21 or between thefirst mother substrate 11 and the second mother substrate 21. Thesensing unit includes a plurality of receiving units, a plurality oftransmitting units or a plurality of sensors, but the present disclosureis not limited thereto.

In another embodiment, the electronic device may be an antenna device,and the antenna device includes a plurality of receiving units or aplurality of transmitting units, and the receiving unit or thetransmitting units can be disposed on the first mother substrate 11, onthe second mother substrate 21 or between the first mother substrate 11and the second mother substrate 21. But, the present disclosure is notlimited thereto.

As shown in FIG. 1 and FIG. 2B, in the step (S2), a first protectionelement 12 is disposed on a surface 11 a of the first mother substrate11 away from the second mother substrate 21. In addition, a secondprotection element 22 is also disposed on a surface 21 a of the secondmother substrate 21 away from the first mother substrate 11. Herein, thefirst mother substrate 11 has an operating region R1 and a border regionR2, and the first protection element 12 may be disposed corresponding tothe border region R2. In some embodiment, the border region R2 may beadjacent to the operating region R1. In some embodiment, the operatingregion R1 may be surrounds by the border region R2. In some embodiment,the operating region R1 may include a display region, a detectingregion, a sensing region or a lighting region, but the presentdisclosure is not limited thereto. The type of the operating region R1depends on the type of the electronic device. In some embodiment, theborder region R2 may include a non-display region, a non-detectingregion, a non-sensing region or a non-lighting region, but the presentdisclosure is not limited thereto.

As shown in FIG. 1 and FIG. 2C, in the step (S3), a first motherpolarizer 13 is disposed on the first protection element 12. In someembodiment, the first mother polarizer 13 comprises a first polarizingstructure 131 and a first adhesive structure 132, and may optionallycomprise other structures, such as a tri-acetate cellulose (TAC) layer;but the present disclosure is not limited thereto. In some embodiment,the TAC layer may be disposed between the first polarizing structure 131and the first adhesive structure 132. In some embodiment, the firstadhesive structure 132 may be disposed between the first polarizingstructure 131 and the first protection element 12. In addition, a secondmother polarizer 23 is disposed on the second protection element 22. Thesecond mother polarizer 23 comprises a second polarizing structure 231and a second adhesive structure 232, and may optionally comprise otherstructures, such as a TAC layer; but the present disclosure is notlimited thereto. In some embodiment, the TAC layer may be disposedbetween the second polarizing structure 231 and the second adhesivestructure 232. In some embodiment, the second adhesive structure 232 maybe disposed between the second polarizing structure 231 and the secondprotection element 22. The first polarizing structure 131 or the secondpolarizing structure 231 may include polyvinyl alcohol (PVA), but thepresent disclosure is not limited thereto. It should be noted that, thefirst mother polarizer 13 or the second mother polarizer 23 cancorrespond to a plurality of first polarizers 13′ (as shown in FIG. 2G)or a plurality of second polarizers 23′ (as shown in FIG. 2G) of panels.

Then, as shown in FIG. 1 and FIG. 2D, in the step (S4), a part of thefirst mother polarizer 13 is removed to form first openings 13 a, 13 bcorresponding to the first protection element 12. The positions of thefirst openings 13 a, 13 b may correspond to the positions of cuttingsites (as indicated by the dot lines) of the first mother substrate 11.That is, the positions of the first openings 13 a, 13 b may beoverlapped with the positions of the cutting sites and/or the firstprotection element 12 in a normal direction Z of the first mothersubstrate 11. Herein, the following step of forming second openings inthe second mother polarizer 23 is described in advance. As shown in FIG.2F, a part of the second mother polarizer 23 is removed to form secondopenings 23 a, 23 b corresponding to the second protection element 22.The positions of the second openings 23 a, 23 b may correspond to thepositions of cutting sites (as indicated by the dot lines) of the secondmother substrate 21. That is, the positions of the second openings 23 a,23 b may be overlapped with the positions of the cutting sites and/orthe second protection element 22 in a normal direction Z of the secondmother substrate 21. It should be noted that, a contour of the firstprotection element 12 or the second protection element 22 may berectangular, polygonal or irregular shape, or have other suitable shapesfrom a top view of the first mother substrate 11. In some embodiments, acontour of the first openings 13 a, 13 b and/or the second openings 23a, 23 b may be rectangular, polygonal or irregular, or have othersuitable shapes from a top view of the first mother substrate 11. Insome embodiments, the contour of the first openings 13 a,13 b and/or thesecond openings 23 a, 23 b may be similar or dissimilar to the contourof first protection element 12 or the second protection element 22.

Herein, the part of the first mother polarizer 13 or the part of thesecond mother polarizer 23 can be removed by a laser having wavelengthranged from 250 nm to 11000 nm (250 nm≤wavelength≤11000 nm) to form thefirst openings 13 a, 13 b or the second mother polarizer 23, but thepresent disclosure is not limited thereto. For example, the part of thefirst mother polarizer 13 can be removed by a CO₂ laser havingwavelength ranged from 9400 nm to 10640 nm (9400 nm≤wavelength≤10640nm), a green laser having wavelength about 533 nm, an UV laser havingwavelength about 355 nm, or a deep UV (DUV) laser having wavelengthabout 266 nm, but the present disclosure is not limited thereto. Thepower of the used laser can be adjusted according to the type of theused laser, and can be ranged from 10 watt (W) to 200 W. For example,200 W CO₂ laser or 10W DUV laser can be used to form the first openings13 a, 13 b or the second openings 23 a, 23 b, and not limited thereto.

The thickness of the first protection element 12 can be in a range from0.05 micrometer (μm) to 50 μm (0.05 μm≤thickness≤50 μm), but the presentdisclosure is not limited thereto. In some embodiments, the thickness ofthe first protection element 12 can be in a range from 0.05 μm to 30 μm(0.05μm≤thickness≤30 μm). In some embodiments, the thickness of thefirst protection element 12 can be in a range from 0.05 μm to 15 μm(0.05 μm≤thickness≤15 μm). The material of the first protection element12 is not particularly limited, as long as the first protection element12 can reduce the damage of the first mother substrate 11 by laser,other removing methods or other cutting methods. For example, the firstprotection element 12 can have an absorptivity of laser in a range from70% to 100% (70%≤absorptivity≤100%), but the present disclosure is notlimited thereto. In some embodiments, the first protection element 12can have an absorptivity of laser is in a range from 80% to 100%(80%≤absorptivity≤100%). In some embodiments, the first protectionelement 12 can have an absorptivity of laser is in a range from 90% to100% (90%≤absorptivity≤100%). In some embodiments, the first protectionelement 12 can have a reflectivity of laser is in a range from 70% to100% (70%≤reflectivity≤100%), but the present disclosure is not limitedthereto. In some embodiments, the first protection element 12 can have areflectivity of laser is in a range from 80% to 100%(80%≤reflectivity≤100%). In some embodiments, the first protectionelement 12 can have a reflectivity of laser is in a range from 90% to100% (90%≤reflectivity≤100%). The first protection element 12 maycomprise polymer, metal, alloy or dielectric material, but the presentdisclosure is not limited thereto. For example, the first protectionelement 12 may include polyimide (PI), triacetate cellulose (TAC),cyclo-olefin polymer (COP), poly(methyl methacrylate) (PMMA),polycarbonate (PC), polyethylenterephthalate (PET), sealant, SiO₂,Al₂O₃, TiO₂, polytetrafluoroethylene (PTFE), Al, Al alloy, Ag, Ag alloy,Au, Au alloy, Cu, Cu alloy, Ti, Ti alloy, Ge, Mo, GaAs, ZnSe or othersuitable material, but the present disclosure is not limited thereto.The material or characteristic of the second protection element 22 maybe similar to that of the first protection element 12, so it will not berepeated. In one embodiment, the first protection element 12 and/or thesecond protection element 22 can be overlapped with the cutting site inthe normal direction Z of the first mother substrate 11 and/or secondmother substrate 21, respectively.

In some embodiment, when the first protection element 12 and/or thesecond protection element 22 is a transparent element, and the firstprotection element 12 and/or the second protection element 22 may bedisposed on at least part of the surface 11 a and/or at least part ofthe surface 21 a. For example, the first protection element 12 and/orthe second protection element 22 can be disposed on both the operationregion R1 and the border region R2. The transparent element may includetransparent dielectric structure or transparent conductive structure.The transparent conductive structure may include indium tin oxide (ITO),indium zinc oxide (IZO) or other suitable conductive materials, but thepresent disclosure is not limited thereto. In another embodiment, thefirst protection element 12 or the second protection element 22 mayinclude PEDOT (Poly-3,4-Ethylenedioxythiophene), CNT (carbon nanotube),carbon mixture, silver nanowire, graphene, graphene oxide, othersuitable materials or combinations thereof, but the present disclosureis not limited thereto.

Herein, the material of the first protection element 12 and/or thematerials of the second protection element 22 can be selected accordingto the laser used for forming the first openings 13 a, 13 b and/or thesecond openings 23 a, 23 b. In one aspect of the present disclosure,when the first openings 13 a, 13 b and/or the second openings 23 a, 23 bare formed by using a CO₂ laser, a green laser, an UV laser or a DUVlaser, and the materials of the first protection element 12 and/or thematerials of the second protection element 22 can be a material withhigh absorptivity of laser, but the present disclosure is not limitedthereto. The material with high absorptivity of laser may include PI,TAC, COP, PMMA, PC, PET, PTFE or sealant. In another aspect of thepresent disclosure, the first openings 13 a, 13 b and/or the secondopenings 23 a, 23 b are formed by using a nanosecond laser with awavelength ranged about from 355 nm to 1060 nm, and the materials of thefirst protection element 12 and/or the materials of the secondprotection element 22 can be a material with high reflectivity of laser,but the present disclosure is not limited thereto. The material withhigh reflectivity of laser may include a metal (such as Al, Ag, Au, Cu,Ge, Ti or Mo), an alloy (such as Al alloy, Ag alloy, Au alloy, Cu alloy,Ge alloy, Ti alloy or Mo alloy) or a dielectric material (such as SiO₂,Al₂O₃, TiO₂, GaAs or ZnSe). In further another aspect of the presentdisclosure, the first openings 13 a, 13 b and/or the second openings 23a, 23 b are formed by using a picosecond laser or a femtosecond laser,but the present disclosure is not limited thereto. All the materialsillustrated above can be used as a material of the first protectionelement 12 and/or the second protection element 22, and the power or thetime for applying the picosecond laser or the femtosecond laser can beadjusted to reduce damage of the first mother substrate 11 and/or thesecond mother substrate 21 of the electronic device.

As shown in FIG. 2D, after a part of the first mother polarizer 13 isremoved and the first openings 13 a, 13 b corresponding to the firstprotection element 12 are formed, a part of a first adhesive structure132 of the first mother polarizer 13 corresponding to the first openings13 a, 13 b may further be removed if the first adhesive structure 132still remain in the first openings 13 a, 13 b. Herein, the firstadhesive structure 132 of the first mother polarizer 13 in the firstopenings 13 a, 13 b can be removed by a chemical treatment, a plasmatreatment or a laser treatment, but the present disclosure is notlimited thereto. The chemical treatment can be performed by usingethanol or acetone, but the present disclosure is not limited thereto.When the first adhesive structure 132 in the first openings 13 a, 13 bis removed by a laser treatment, this laser treatment can be the lasertreatment performed in the following step of removing the firstprotection element 12 in the first openings 13 a, 13 b, but the presentdisclosure is not limited thereto. The laser treatment may be ablation,but the present disclosure not limited thereto.

In another embodiment of the present disclosure, if the first protectionelement 12 can be served as a release film (or a release element), thefirst adhesive structure 132 in the first openings 13 a, 13 b can beremoved easily, so the step of removing the first adhesive structure 132in the first openings 13 a, 13 b can bypass. The release film mayinclude oxygenated resin, formaldehyde resin, platinum catalyst,isopropanol, toluene, methanol, isopropanol fluorine, fluorene compound,or other suitable material, but the present disclosure is not limitedthereto.

In some embodiment, the first protection element 12 is overlapped withthe first openings 13 a, 13 b in a normal direction Z of the firstmother substrate 11. In addition, the first opening 13 a has a firstwidth W1, the first protection element 12 corresponding to the firstopening 13 a has a second width W2, and the second width W2 is equal toor greater than the first width W1. The first opening 13 b has a firstwidth W1′, the first protection element 12 corresponding to the firstopening 13 b has a second width W2′, and the second width W2′ is equalto or greater than the first width W1′. Herein, the first width W1 orthe first width W1′ is defined as the maximum width of the first opening13 a or the first opening 13 b in a direction perpendicular to anextension direction of the first opening 13 a or the first opening 13 b.The second width W2 or the second width W2′ are defined as the maximumwidth of the first protection element 12 in a direction perpendicular toan extension direction of the first protection element 12. In detail,the first protection elements 12 or the second protection elements 22may have different extension direction. In some embodiments, the firstprotection elements 12 or the second protection elements 22 mayrespectively correspond to or adjacent to different sides of the panelof the electronic device. In some embodiments, the first protectionelements 12 or the second protection elements 22 can be continuous orseparated.

The first openings 13 a, 13 b can respectively have the first widths W1,W1′ in a range from 0.1 millimeter (mm) to 60 mm (0.1 mm≤W1 or W1′≤60mm), but the present disclosure not limited thereto. In someembodiments, the first openings 13 a, 13 b can respectively have thefirst widths W1, W1′ in a range from 0.1 mm to 40 mm (0.1 mm≤W1 orW1′≤40 mm) In some embodiments, the first openings 13 a, 13 b canrespectively have the first widths W1, W1′ in a range from 0.1 mm to 30mm (0.1 mm≤W1 or W1′≤30 mm) The first widths W1, W1′ of the firstopenings 13 a, 13 b can be adjusted according to the method used forcutting the first mother substrate 11 in the following steps.

If the first mother substrate 11 is cut by a nanosecond laser, apicosecond laser or a femtosecond laser, the first widths W1, W1′ of thefirst openings 13 a, 13 b can be defined as follows. The first mothersubstrate 11 has a first thickness D1, the first protection element 12has a second thickness D2, the first mother polarizer 13 has a thirdthickness D3, and the first opening 13 a has the first width W1; whereinthe first thickness D1, the second thickness D2, the third thickness D3and the first width W1 satisfy the following equation:

(D3+D2+D1)/2≤W1.

The first thickness D1 is defined as a maximum thickness of the firstmother substrate 11 corresponding to the first protection element 12measured in the normal direction Z of the first mother substrate 11. Thesecond thickness D2 is defined as a maximum thickness of the firstprotection element 12 measured in the normal direction Z of the firstmother substrate 11. The third thickness D3 is defined as a maximumthickness of the first mother polarizer 13 corresponding to the firstprotection element 12 measured in the normal direction Z of the firstmother substrate 11. In addition, the first width W1′ of the firstopening 13 b can also be defined by the above equation by replacing thefirst width W1 of the first opening 13 a with the first width W1′ of thefirst opening 13 b.

For example, when the first thickness D1 of the first mother substrate11 is about 150 μm, the second thickness D2 of the first protectionelement 12 is about 1 μm, and the third thickness D3 of the first motherpolarizer 13 is about 150 μm, the first widths W1, W1′ of the firstopenings 13 a, 13 b can respectively be 150.5 μm. However, the presentdisclosure is not limited thereto.

If the first mother substrate 11 is cut by a CO₂ laser or a CO laser,the first widths W1, W1′ of the first openings 13 a, 13 b can be in arange from 0.8 mm to 2 mm (0.8 mm≤W1 or W1′≤2 mm), but the presentdisclosure is not limited thereto.

If the first mother substrate 11 is cut by a cutting wheel, the firstwidths W1, W1′ of the first openings 13 a, 13 b can be in a range from0.8 mm to 10 mm (0.8 mm≤W1 or W1′≤10 mm), but the present disclosure isnot limited thereto.

Then, as shown in FIG. 2E, a part of the first protection element 12corresponding to the first openings 13 a, 13 b may be removed to formthird openings 12 a, 12 b, and the third openings 12 a, 12 b mayrespectively correspond to the first openings 13 a, 13 b of the firstmother polarizer 13. More specifically, at least part of the thirdopenings 12 a, 12 b may be respectively overlapped with the firstopenings 13 a, 13 b in the normal direction Z of the first mothersubstrate 11. Herein, the first protection element 12 in the firstopenings 13 a, 13 b can be removed by an ablation process. The ablationprocess can be accomplished by, for example, a picosecond laser or afemtosecond laser, but the present disclosure is not limited thereto.

As shown in FIG. 1 and FIG. 2F, in the step (S5), the first mothersubstrate 11 is cut. More specifically, the first mother substrate 11 iscut according to the cutting sites (as indicated by the dot lines).Herein, the first mother substrate 11 can be cut by a laser, and thelaser includes a nanosecond laser, a picosecond laser, a femtosecondlaser, a CO₂ laser or a CO laser, but the present disclosure is notlimited thereto.

As shown in FIG. 2F, a part of the second mother polarizer 23 is removedto form second openings 23 a, 23 b corresponding to the secondprotection element 22. The second adhesive structure 232 remaining inthe second openings 23 a, 23 b is removed if it is necessary. The secondprotection element 22 in the second openings 23 a, 23 b is removed toform fourth openings 22 a, 22 b, the fourth openings 22 a, 22 b mayrespectively correspond to the second openings 23 a, 23 b of the secondmother polarizer 23, and at least part of the fourth openings 22 a, 22 bmay be respectively overlapped with the second openings 23 a, 23 b inthe normal direction Z of the first mother substrate 11. Then, thesecond mother substrate 21 is cut. The methods for forming the secondopenings 23 a, 23 b and the fourth openings 22 a, 22 b are similar tothe methods for forming the first openings 13 a, 13 b and the thirdopenings 12 a, 12 b. The method for cutting the second mother substrate21 is similar to the method for cutting the first mother substrate 11.The method for removing the second adhesive structure 232 is alsosimilar to the method for removing the first adhesive structure 131.Thus, the descriptions thereof are not repeated again.

Finally, after removing a part of the first mother substrate 11 in theborder region R2 and a part of the second mother substrate 21 in theborder region R2, a panel of an electronic device of the presentembodiment is obtained, as shown in FIG. 2G. As shown in FIG. 1, FIG. 2Fand FIG. 2G, in the step (S6), the assembly of the first mothersubstrate 11, the second mother substrate 21, the first protectionelement 12, and the first mother polarizer 13 is processed into aplurality of panels. In some embodiments, a part of the first protectionelement 12 is remaining in the electronic device. In some embodiments, apart of the second protection element 22 is remaining in the electronicdevice.

In other embodiments, we can add other steps or cancel some stepsdepending on demand. In other embodiments, we can adjust the order ofthe above steps depending on demand. For example, we can remove a partof the first mother polarizer 13 to form the first openings 13 a, 13 b,and remove a part of the second mother polarizer 23 to form the secondopenings 23 a, 23 b before the step of removing the part of the firstprotection element 12 in the first openings 13 a, 13 b to form thirdopenings 12 a, 12 b, but the present disclosure is not limited thereto.In one embodiment, the first mother substrate 11 may be cut before thestep of cutting the second mother substrate 21. In another embodiment,the second mother substrate 21 can be cut before the step of cutting thefirst mother substrate.

In the method for manufacturing an electronic device of the presentembodiment, the first protection element 12 and/or the second protectionelement 22 is disposed before the step of disposing the first motherpolarizer 13 and/or the second mother polarizer 23. During forming thefirst openings 13 a, 13 b of the first mother polarizer 13 or the secondopenings 23 a, 23 b of the second mother polarizer 23, the firstprotection element 12 or the second protection element 22 canrespectively protect the first mother substrate 11 or the second mothersubstrate 21 from being damaged. Therefore, the yield of the electronicdevice of the present embodiment can be increased.

EMBODIMENT 2

FIG. 3A to FIG. 3D are cross-sectional views showing a process formanufacturing an electronic device of the present embodiment. Theprocess for manufacturing an electronic device is similar to thosedescribed in Embodiment 1, except for the following differences.

In Embodiment 1, the first mother substrate 11 and the second mothersubstrate 21 are cut by a laser. In the present embodiment, the firstmother substrate 11 and the second mother substrate 21 are cut by acutting wheel. Some steps performed in the present embodiment aresimilar to the steps shown in FIG. 2A to FIG. 2C, and these steps arenot repeated again.

The widths of the first openings 13 a, 13 b and/or the second openings23 a, 23 b in the present embodiment may be greater than the widths ofthe first openings 13 a, 13 b and/or the second openings 23 a, 23 b inEmbodiment 1, but the present disclosure is not limited thereto.

In the present embodiment, as shown in FIG. 3A, the first slots 13 cand/or the second slots 23 c are formed in the first mother polarizer 13and/or the second mother polarizer 23. The first slots 13 c can definethe edges of the first openings 13 a, 13 b. The second slots 23 c candefine the edges of the second openings 23 a, 23 b. Herein, the firstslots 13 c and/or the second slots 23 c can be formed by a laserprocess, which is similar to the laser process for forming the firstopenings 13 a, 13 b and the second openings 23 a, 23 b described inEmbodiment 1.

Next, as shown in FIG. 3B, a part of the first mother polarizer 13 isremoved (such as peeled off) to form the first openings 13 a, 13 bcorresponding to the first protection element 12. Additionally, thefirst adhesive structure 132 in the first openings 13 a, 13 b is removedif it is necessary. The method for removing the first adhesive structure132 in the first openings 13 a, 13 b is similar to that illustrated inEmbodiment 1. Then, a cutting wheel 3 is used to cut the first mothersubstrate 11.

As shown in FIG. 3C, after the first mother substrate 11 is cut, a partof the second mother polarizer 23 is removed to form the second openings23 a, 23 b corresponding to the second protection element 22.Additionally, the second adhesive structure 232 in the second openings23 a, 23 b is removed if it is necessary. Then, a cutting wheel 3 isused to cut the second mother substrate 21.

Finally, after removing a part of the first mother substrate 11 in theborder region R2 and a part of the second mother substrate 21 in theborder region R2, a panel of an electronic device of the presentembodiment is obtained, as shown in FIG. 3D. In some embodiments, a partof first protection element 12 is remaining in the electronic device. Insome embodiments, a part of second protection element 22 is remaining inelectronic device.

In Embodiment 1 or Embodiment 2, the first mother substrate 11 is cutbefore the step of cutting the second mother substrate 21. In anotherembodiment, the second mother substrate 21 can be cut before the step ofcutting the first mother substrate 11.

It should be noted that, as shown in FIG. 3B, when the first mothersubstrate 11 and the second mother substrate 21 are cut by the wheelcutter, the position of cutting sites (as indicated by the dot lines) ofthe second mother substrate 21 and the position of cutting sites (asindicated by the dot lines) of the first mother substrate 11 can bestaggered. That is, the position of cutting sites of the second mothersubstrate 21 are not overlapped with the position of cutting sites ofthe first mother substrate 11 in the normal direction Z of the firstmother substrate 11. In other words, when the second mother substrate 21is cut, if the position of cutting sites of the second mother substrate21 are not overlapped with a part of the first mother polarizer 13 or apart of the first mother substrate 11 in the normal direction Z of thefirst mother substrate 11, the position of cutting sites of the secondmother substrate 21 are not be supported; so during the process ofcutting the second mother substrate 21, an uneven cutting plane iseasily caused, so the yield of the electronic device may be reduced.When the first mother substrate 11 is cut, if the position of cuttingsites of the first mother substrate 11 are not overlapped with a part ofthe second mother polarizer 23 or a part of the second mother substrate21 in the normal direction Z of the first mother substrate 11, theposition of cutting sites of the first mother substrate 11 are not besupported; so during the process of cutting the first substrate 11, anuneven cutting plane is easily caused, so the yield of the electronicdevice may be reduced. Through the above method, we can reduce the aboveproblems or increase the yield of the electronic device.

As shown in FIG. 2G and FIG. 3D, an electronic device can be provided,which comprises a panel P. The panel P comprises: a first substrate 11′(which is a part of the first mother substrate 11), a second substrate21′ (which is a part of the second mother substrate 21), a firstprotection element 12, a first polarizer 13′ (which is a part of thefirst mother polarizer 13), a second protection element 22 and a secondpolarizer 23′ (which a part of the second mother polarizer 23). Thesecond substrate 21′ is disposed opposite to the first substrate 11′,the first protection element 12 is disposed on a surface of the firstsubstrate 11′ away from the second substrate 21′, the first polarizer13′ is disposed on the first protection element 12, the secondprotection element 22 is disposed on a surface of the second substrate21′ away from the first substrate 11′, and the second polarizer 23′ isdisposed on the second protection element 22. Thus, one of the obtainedpanels (i.e. the aforesaid electronic device) comprises a part of thesecond mother polarizer 23, a part of the first mother substrate 11, apart of the first protection element 12, a part of second protectionelement 22, a part of the first mother polarizer 13 and a part of thesecond mother polarizer 23.

In addition, the first polarizer 13′ comprises a first polarizingstructure 131 and a first adhesive structure 132, and the first adhesivestructure 132 is disposed between the first polarizing structure 131 andthe first protection element 12. The second polarizer 23′ comprises asecond polarizing structure 231 and a second adhesive structure 232, andthe second adhesive structure 232 is disposed between the secondpolarizing structure 231 and the second protection element 22.

In some embodiments, the area of the second polarizer 23′ may be equalto or greater than the area of the first polarizing 13′ in the normaldirection Z of the first substrate 11′. In some embodiments, the area ofthe area of the second substrate 21′ may be equal to or greater than thearea of the area of the first substrate 11′ in the normal direction Z ofthe first substrate 11′. In some embodiment, the area of the firstsubstrate 11′ may be equal to or greater than the area of the firstpolarizing 13′ in the normal direction Z of the first substrate 11′. Insome embodiments, the area of the second substrate 21′ may be equal toor greater than the area of the second polarizer 23′ in the normaldirection Z of the first substrate 11′.

In some embodiments, a distance between an edge 11′e of the firstsubstrate 11′ and an edge 12 e of the first protective layer 12 is in arange from 0 mm to 50 mm (0 mm≤distance≤50 mm), but the presentdisclosure is not limited thereto. In some embodiments, a distancebetween the edge 11′e of the first substrate 11′ and the edge 12 e ofthe first protective layer 12 is in a range from 0 mm to 30 mm (0mm≤distance≤30 mm) In some embodiments, a distance between an edge 21′eof the second substrate 21′ and an edge 22 e of the second protectivelayer 22 is in a range from 0 mm to 50 mm (0 mm≤distance≤50 mm), but thepresent disclosure is not limited thereto. In some embodiment, adistance between the edge 21′e of the second substrate 21′ and the edge22 e of the second protective layer 22 is in a range from 0 mm to 30 mm(0 mm≤distance≤30 mm) The distance between the edge 11′e of the firstsubstrate 11′ and the edge 12 e of the first protective layer 12 isdefined by the maximum distance, and the edge 12 e of the firstprotective layer 12 is defined by the edge closest to the edge 11′e ofthe first substrate 11′ (such as the lateral edge). The distance betweenthe edge 21′e of the second substrate 21′ and the edge 22 e of thesecond protective layer 22 is defined by the maximum distance, and theedge 22 e of the second protective layer 22 is defined by the edgeclosest to the edge 21′e of the second substrate 21′ (such as thelateral edge). In some embodiments, the edge 12 e of the firstprotection element 12 is located between an edge 13′e of the firstpolarizer 13′ and the edge 11′e of the first substrate 11′ in the normaldirection Z of the panel P. In some embodiments, the edge 22 e of thesecond protection element 22 is located between an edge 23′e of thesecond polarizer 23′ and the edge 21′e of the second substrate 21′ inthe normal direction Z of the panel P. In some embodiments, an area ofthe first protection element 12 is different from an area of the secondprotection element 22. The area of the first protection element 12 isdefined by a maximum area of the first protection element 12 in thenormal direction Z of the panel P. The area of the second protectionelement 22 is defined by a maximum area of the second protection element22 in the normal direction Z of the panel P. In some embodiments, awidth of the first protection element 12 is different from a width ofthe second protection element 22. The width of the first protectionelement 12 is defined by a maximum width of the first protection element12 in a direction perpendicular to an extension direction of the firstprotection element 12. The width of the second protection element 22 isdefined by a maximum width of the second protection element 22 in adirection perpendicular to an extension direction of the secondprotection element 22. In some embodiments, the electronic device can bea self-luminous electronic device, and the self-luminous electronicdevice may include OLED, LED, mini-LED, micro-LEDs, or QLED or othersuitable materials, but the present disclosure is not limited thereto.In some embodiments, the self-luminous electronic devices may notcomprise the second polarizer 23′ or the second protective layer 22. Forexample, the first substrate 11′ can be a cover substrate, and thesecond substrate 21′ can be an array substrate, and the second polarizer23′ or the second protective layer 22 is not required.

When the electronic device is a display device, the display device canbe co-used with a touch panel to form a touch display device. Meanwhile,a display device or touch display device may be applied to anyelectronic devices known in the art that need a display screen, such asdisplays, mobile phones, laptops, video cameras, still cameras, musicplayers, mobile navigators, TV sets, tiled electronic devices, curvatureelectronic devices, free shaped electronic devices or other electronicdevices that display images.

Although the present disclosure has been explained in relation to itsembodiment, it is to be understood that many other possiblemodifications and variations can be made without departing from thespirit and scope of the disclosure as hereinafter claimed.

What is claimed is:
 1. An electronic device, comprising: a panel,comprising: a first substrate; a second substrate, disposed opposite tothe first substrate; a first protection element, disposed on a surfaceof the first substrate away from the second substrate; and a firstpolarizer, disposed on the first protection element.
 2. The electronicdevice of claim 1, wherein a distance between an edge of the firstsubstrate and an edge of the first protective element is in a range from0 mm to 50 mm
 3. The electronic device of claim 1, wherein an edge ofthe first protection element is located between an edge of the firstpolarizer and an edge of the first substrate in a normal direction ofthe panel.
 4. The electronic device of claim 1, wherein a thickness ofthe first protection element is in a range from 0.05 μm to 50 μm.
 5. Theelectronic device of claim 1, wherein the first polarizer comprises afirst polarizing structure and a first adhesive structure, and the firstadhesive structure is disposed between the first polarizing structureand the first protection element.
 6. The electronic device of claim 1,further comprising: a second protection element, disposed on a surfaceof the second substrate away from the first substrate; and a secondpolarizer, disposed on the second protection element.
 7. The electronicdevice of claim 6, wherein a width of the first protection element isdifferent from a width of the second protection element.